Semiconductor Packaging News
TSMC and Nvidia Team Op on Silicon Photonics, CEO Jensen Huang Says Nvidia and TSMC have teamed up to advance silicon photonics, a promising low-power technology for optical …
Semiconductor Packaging News
In 2025, the semiconductor market is set for growth, with analysts projecting a 20% increase as demand rebounds from recent declines. Despite geopolitical and economic uncertainties, the …
Semiconductor Packaging News
The death of Queen Victoria ends an era in which most of her British subjects know no other monarch. Her reign, the longest in British history, saw the growth of an empire on which the …
Semiconductor Packaging News Index
SIA Applauds CHIPS Act Incentives for Infinera, Corning, Edwards Vacuum, and GlobalFoundries The Semiconductor Industry Association praised recent CHIPS Act agreements supporting …
Semiconductor Packaging News
U.S. launches new probe into legacy Chinese chips as tech pressure on Beijing escalates The Biden administration launched a Section 301 probe into Chinese legacy semiconductors, citing …
Funding Competition for Up to $1.6 Billion to Accelerate U.S ...
Funding Competition for Up to $1.6 Billion to Accelerate U.S. Semiconductor Advanced Packaging Technologies: Summary The Biden-Harris Administration announced a $1.6 billion …
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that …
CHIPS Subsidy Boosts Advanced Packaging in U.S.
A $1.6 billion CHIPS Act subsidy aims to boost U.S. advanced-packaging capacity. Taiwan's ASE and others double California capacity to support AMD, Apple, and Nvidia. The U.S. …
Semiconductor Packaging Press Release Index
Jan 22, 2025 Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West Indium Corpor ation® will feature its high-reliability, Au-based precision die …
Samsung automating semiconductor packaging, doubling efficiency
Samsung accelerates IC manufacturing with advanced packaging automation, aiming to enhance production efficiency. The tech giant has announced plans to implement cutting-edge …