An international research team has assessed the impact of soldering flux on heterojunction solar cells and has found that the composition of this component is key to prevent major cracks and ...

SHENMAO America, Inc. is proud to announce that its solder materials have received UL ECVP 2809 (UL Environmental Claim Validation Procedure) certification for recycled content. This prestigious ...

It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount production line can ...

What is the current share price of Bega Cheese Limited (BGA)? Bega Cheese Limited's (BGA) current share price is $5.78. This constitutes a price movement of 1.03% when compared to the share price 7 ...

With FPGA packages exceeding 1,000 pins, with Ball Grid Array (BGA) solder bumps providing the interconnect, it is vitally important to make solid contact with the Printed Circuit Board (PCB).

Abstract: A finite element analysis model of a printed circuit board assembly (PCBA) was established. The model was subjected to a reflow soldering temperature profile to analyze the temperature ...

See how this innovative change enhances the soldering process, making it faster and more efficient. Prepare to be amazed by the surprising power and performance of this upgraded tool. Against the ...

The problem is with the BGA solder balls that connect the image sensor ... That’s an expensive process: they say it will cost $7 for each, more than the actual sensor cost initially.

[Felix] solved this problem by making his own solder paste stencils very cheaply using empty soda cans. The process begins just like any other home etching tutorial by lightly sanding the un-bent ...