The solder bumps can be 0.6mm in diameter and placed on 1mm center to center. 2. Points of Failure: BGA Solder Joints The following is a list of some points of failure associated with FPGAs in BGA ...

We’re used to those high voltage projects which use a self-oscillating transformer circuit with a TV flyback winding, and we ...

MIDWAY, Utah — Soldier Hollow, the 2002 Olympic venue, hosted hundreds of cross-country ski U23 athletes in the annual “Super Q” race Friday through Sunday. “It’s so fun to see the whole Western ...

At the heart of these systems are ball grid arrays (BGAs)—the tiny solder joints that provide the electrical and mechanical connections essential for smooth operation (see Figure 1). While they may be ...