[Colin] uses some spare boards to lock the target board down to his bench and then uses a custom stencil and solder paste to prep ... although the BGA could have concealed faults that would ...

Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied ... This isn’t an easy process, so [Edmar] came up with his own BGA rework station that costs much ...

The Reverse Hybrid process utilizes SAC (Sn-Ag-Cu) solder paste and BGA components with LTS (Low Temperature Solder) balls. Using a SAC reflow profile, this innovative method forms homogeneous ...